Hi,
It’s possible this isn’t supported, I haven’t been able to find a definitive answer yet on
whether this configuration is supported or not.
Our switches don’t support MLAG so I’m unable to create an LACP bond between the server to
two switches.
Regards,
James.
On 1 Apr 2020, at 12:41, Robert Sander
<r.sander(a)heinlein-support.de> wrote:
On 01.04.20 08:29, James, GleSYS wrote:
The reason I want to create two bonds is to have
enp179s0f0 as active for the public network, and enp179s0f1 as active for the cluster
network, therefore spreading the traffic across the nics.
I do not think this will work. AFAIK you cannot create a bonding device
from VLAN interfaces, you have to make it the other way around, create
VLAN interfaces on top of your bonding.
Why not bond in LACP mode and use both interface in parallel?
Regards
--
Robert Sander
Heinlein Support GmbH
Schwedter Str. 8/9b, 10119 Berlin
https://www.heinlein-support.de
Tel: 030 / 405051-43
Fax: 030 / 405051-19
Amtsgericht Berlin-Charlottenburg - HRB 93818 B
Geschäftsführer: Peer Heinlein - Sitz: Berlin
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